Speaker abstracts for the 2020 World Adhesive & Sealant Conference should be submitted online by August 30.
August 28, 2019
Interested parties are invited to share their knowledge and innovations on a range of topics at the 2020 World Adhesive & Sealant Conference, which will be held April 20-22 in Chicago.
Designed for use in interior settings, MAPEI’s Ultrabond ECO 907 reportedly works to bond most common construction materials, including plywood and lumber framing, engineered and solid wood flooring, carpet tackstrips, and polystyrene insulation boards.
August 27, 2019
MAPEI recently introduced Ultrabond ECO 907, a fast-curing, 100% solids, silane-modified polymer, gun-grade adhesive for basic wood subfloor construction.
According to PPG, its Teslin substrate is a durable, secure, and easy-to-print synthetic material that excels in applications that demand a tough, high-performance label solution.
August 27, 2019
PPG recently announced that it will showcase PPG TESLIN® substrate for adhesive coaters, label converters, and packaging specialists during Labelexpo Europe 2019, which will be held September 24-27 in Brussels, Belgium.
Michelman reports that its low-VOC architectural coatings enhance scuff, scrub, scratch, burnish, and abrasion resistance.
August 26, 2019
Michelman, a bronze sponsor and exhibitor at Coating Trends & Technologies (CTT) 2019, recently announced that it will feature its line of sustainable waterborne surface modifiers for improving the performance of exterior wood coatings and architectural paint coatings.
Nouryon expects that the projects in Rotterdam will enable it to continue meeting growing demand for metal alkyls from customers in the polymer industry and improve supply reliability in Europe.
August 26, 2019
Nouryon recently announced that it has made a series of investments at its metal alkyls plant in Rotterdam, the Netherlands, to improve efficiency and increase capacity.
The investigation reportedly shows that reworkable adhesives can enhance the board-level reliability of large WLPs, even for harsh environment applications.
August 23, 2019
At the SMTA International 2019 technical conference, which will be held September 22-26 in Rosemont, Ill., Portland State University and Zymet will present their investigations on enhancing the board-level reliability of large wafer-level packages (WLPs) for harsh environment applications.
The expansion of the foodservice industry, along with the emergence of “takeaway” and “grab-and-go” services, will continue to provide potential growth prospects for the compostable foodservice packaging market.
August 23, 2019
Worldwide sales of compostable foodservice packaging reached approximately 6,400 tons worth $16.7 million in 2018; the market is projected to grow at a CAGR of around 5% through 2029.