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Michelin is building an initial industrial demonstration unit for the 5-HMF molecule, a bio-sourced and non-toxic molecule that can replace ingredients derived from fossil fuels in a wide variety of industrial fields. 

The IPC APEX EXPO 2026, a leading event in the electronics manufacturing industry, is now accepting abstracts for technical papers, posters, and professional development courses. 

Pressure-sensitive adhesive tapes from Avery Dennison Performance Tapes help secure structures against the elements.

H.B. Fuller has officially launched its new regional manufacturing facility in Ras Al Khaimah Economic Zone (RAKEZ), which is located within the emirate of Ras Al Khaimah in the United Arab Emirates (UAE). 

Toyochem has developed quick-cure technology that eliminates the aging process, resulting in faster processing speeds.

A new thermally conductive gap filler for applications in power electronics, SEMICOSIL^® 9649 TC is a silicone product that can withstand high thermal stresses. 

Dow has signed a sale and purchase agreement to sell its 50% interest in DowAksa Advanced Composites Holdings BV (DowAksa) to the other 50% partner in the joint venture. 

Responding to rising demand for high-quality specialty silicones in China, WACKER is expanding its production capacities at its Zhangjiagang, China, site.

ROSS VCB-10 V-Blenders are designed for precision mixing of free-flowing solids. 

The Adhesion Society is inviting industry professionals to submit a presentation proposal (abstract) for inclusion in the 2026 Annual Meeting program.