The potting of electronic components involves filling the assembly with a compound such as liquid resin (e.g., epoxy, silicone, polyurethane) to protect it from environmental or use conditions like moisture, humidity, and vibration. Any air entrapment in the potting compound can result in air bubbles that may cause performance problems in the finished component.

Is your company adapting production to meet a pandemic-related need? I’d love to hear about it! Please contact me at suttons@bnpmedia.com to share your story.

When running a business, many scenarios cross your mind. You prepare and plan and adapt. Yet very few, if any, can say they were prepared for the global pandemic that has put stress on not only their company, but also its team members and its operations. As always in challenging times, good things still have the opportunity to happen.

Preeflow, a ViscoTec brand, has launched the compact eco-DUOMIX, a dispensing solution that can mix and dispense silicones, epoxy resins, polyurethanes, polyester resins, and acrylates.

While many filling technologies exist, gravimetric or net weight fillers remain a predominant fill method in the CASE industry. These fillers utilize a scale to measure the precise amount of product dispensed to a container.