Pressure-Sensitive Adhesives (PSAs)

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AD Fusion from Avery Dennison is a program designed to help label and packaging converters adopt RFID technology.

Here are four of the latest adhesive technologies developed for packaging applications, supporting recyclability, manufacturing efficiency, and a wider range of packaging materials.

LOUPE Americas 2026, formerly Labelexpo Americas, will feature The Label Trail, a live demonstration of the label production process from job specification through printing and finishing.

According to the U.S. Department of Housing and Urban Development and the U.S. Census Bureau, overall housing starts declined 12.4% in July.

A new product range features adhesives in various viscosities for a variety of substrates.

Henkel Adhesive Technologies announced the launch of Loctite ABLESTIK CDF900, its next-generation conductive die attach film (cDAF) series, at SEMICON Taiwan 2026.

The new line of tape encourages children to confidently apply their imagination and bring their biggest ideas to life with simple materials and without the mess of glue.

The pressure-sensitive adhesive formulations help manufacturers reduce environmental impact.

A novel additive from Estron Chemical helps acrylic pressure-sensitive adhesives deliver enhanced adhesion to low-surface-energy substrates without sacrificing shear strength.

Avery Dennison Corp. recently appointed Dave Collins vice president, sales and customer service, Label and Packaging Materials, North America.