We have all seen and experienced so many changes over the past few months. COVID-19 has caused a health crisis on a level most of us hadn’t even imagined, beyond the pages of dystopian fiction.

The potting of electronic components involves filling the assembly with a compound such as liquid resin (e.g., epoxy, silicone, polyurethane) to protect it from environmental or use conditions like moisture, humidity, and vibration. Any air entrapment in the potting compound can result in air bubbles that may cause performance problems in the finished component.

The automated application of sealants and adhesives in settings such as automotive production requires that predictable, reproducible quantities are applied, and that they flow properly and remain in place during the final setting period.

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Independent testing and third-party validation of application-specific and customer-required adhesive products are expected across the value chain. It is especially important to validate adhesive performance for the electronics industry.