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electronic components

Nondestructive Inspection for Heat Sink Efficiency

Acoustic micro-imaging tools produce acoustic images of internal features, including gaps, in electronic components.
Tom Adams
June 1, 2017
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Electronic components that contain a die require a path by which excess heat can be removed from the component package. In low-voltage plastic-encapsulated microcircuits, the heat may simply travel by conduction through the die attach and the die paddle for dissipation through the bottom of the package.
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CHEMQUEST-Cynthia-Gosselin-photo

ChemQuest’s Gosselin Receives ASTM Award

The award was given for her leadership role as an officer within Committee A05’s Technical Subcommittee A05.11 on Coated Sheet Specifications.
May 26, 2017
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The ChemQuest Group Inc. recently announced that Cynthia A. Gosselin, Ph.D., has been awarded the American Society for Testing and Materials (ASTM) International’s Kenneth J. Boedecker, Jr. Distinguished Service Award.


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