THERMLfilm® HT™ is a new advanced line of high-temperature polyimide films reportedly able to withstand the fluctuating temperatures, abrasion and chemicals inherent in the printed circuit board (PCB) manufacturing process.
To simplify silicone ingot bonding and protect against wafer breakage, this company has introduced Loctite® 3382(TM), a water-debondable epoxy adhesive that can reportedly provide excellent bond strength to both silicon and the glass and metal mounting substrates used during the ingot sawing process.
This company recently announced its newly designed website, which offers access to detailed information on the company’s line of adhesive products and applications, adhesive industry news, updates, and a new resource section.
This branch of the American Chemistry Council has announced the availability of its 2010 End-Use Market Survey on the Polyurethanes Industry in the U.S., Canada and Mexico.
A new silicone encapsulant for the solar industry is available that can enable flexible thin-film modules to be laminated cost effectively using roll-to-roll processing.
The service provides an opportunity for customers to program and confirm an automated dispensing application without having to purchase equipment or allocate engineering time to assure the investment.
This company, a business group of The Dow Chemical Co., has launched a newly redesigned website that provides advanced functionality on a global scale while highlighting local resources.
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