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Home » Topics » Adhesive & Sealant Products

Adhesive & Sealant Products
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UV III SYSTEMS: Lightweight UV-Curing System

March 14, 2005
UV III Systems has introduced the Sidekick, a high-powered, air-cooled, flood UV-curing system designed for use in smaller applications or in the enhancement of production lines.
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BROOKFIELD: Explosion-Proof In-Line Viscosity Controller

March 14, 2005
Brookfield Engineering Laboratories, Inc. now offers the AST-100 Explosion Proof viscosity controller, a versatile instrument for a wide variety of printing applications.
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SARTOMER: Thermoplastic Polyurethane Resin

March 14, 2005
Sartomer Company has announced the introduction of the first commercially available thermoplastic polyurethane (TPU) resin based on unique polybutadiene polyols.
Read More

DEVCON: Flex Welder FC

March 14, 2005
Devcon's new Flex Welder FC (Fast Cure) is ideal for quickly and permanently assembling products subject to flexing, shock, vibration or variations in temperature up to 250 degrees F.
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TA INSTRUMENTS: Extensional Viscosity Fixture

March 14, 2005
TA Instruments has announced the release of its new ARES-EVF Extensional Viscosity Fixture.
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BINKS: Agitator Line For Heavy-Duty Applications

March 14, 2005
A new agitator line from Binks is applicable to 2-, 5-, 10-, 15-, 30- and 60-gallon pressure tanks, 5- and 10-gallon pails, and open or closed drums up to 55-gallons that use agitators to mix fluid materials.
Read More

AREMCO: Dielectric Adhesive and Coating System

March 14, 2005
Pyro-Putty 677 is an advanced, single-part, water-dispersed, alumina-silica-based thixotropic adhesive and coating system for use in electrical insulation and bonding applications to 2400 degrees F.
Read More

MASTER BOND: Optically Clear Low Viscosity Epoxy

March 7, 2005
Master Bond Inc. recently developed a new two-component, room-temperature-curing epoxy for bonding, coating, sealing and casting called EP30LV.
Read More

DOW CORNING: New Lid-Seal Adhesive

March 7, 2005
Dow Corning Corp. has announced the introduction of DOW CORNING EA-6700 Microelectronic Adhesive.
Read More

HENKEL: Lead-Free Water-Wash Solder Paste

March 7, 2005
Following on the heels of several innovative solder material introductions, the electronic group of Henkel has launched its latest lead-free solder paste, Multicore WS300.
Read More
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