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Home » Topics » Adhesive & Sealant Products

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Speedline Technologies: MPM Next Generation Pump

November 17, 2003
Speedline Technologies Inc. has introduced MPM's next generation pump technology, a design that reduces materials costs, facilitates quick changeovers and expands the range of usable materials.
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Shimadzu: High Sensitivity Atomic Absorption

November 17, 2003
Shimadzu Scientific Instruments has introduced the AA-6300 Atomic Absorption Spectrophotometer which features a Dynamic Beam Management System to ensure long-term baseline stability with low noise levels.
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Pactiv Polyplank: Soft Foam Plank Alternative

November 17, 2003
Pactiv Corp. has announced its PolyPlank SFT "soft" foam plank product.
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ConProTec: Comprehensive Mixpac Adhesive Selection Guide On CD-ROM

November 17, 2003
ConProTec Inc. has announced the availability of its MIXPAC Adhesive Selection Guide on CD-ROM.
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Asymtek: High-Speed Dispensejet DJ-9000 Jet

November 17, 2003
Asymtek has released its DispenseJet DJ-9000 jet for precise, high-speed delivery of a wide variety of fluids including underfill, surface mount adhesive, encapsulants, conformal coatings, UV adhesives and silver epoxy.
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Henkel Loctite: Brochure

November 17, 2003
New literature from Henkel Loctite Corp. overviews the company's Thread Treatment Sticks, a line of threadlocking, thread sealing and anti-seize products in semi-solid stick form.
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EMI: UV Light/Heat Curable Adhesive

November 11, 2003
A UV light and/or heat-curing adhesive, EMCAST 3415 GEN 2 is available for sampling.
Read More

Cincinnati Automation: Vision Inspection and Robot Guidance System

November 11, 2003
Cincinnati Automation Ltd. has released literature describing its upgraded high performance machine vision and robot guidance system.
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National Adhesives: Literature on Window Adhesives

November 11, 2003
New technical literature on Resyn Patch window adhesives, which provide the high tack required for high and ultra-high speed envelope window patching units, is available from National Adhesives.
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DEK : ProFlex Technology

November 11, 2003
ProFlex technology, introduced by DEK, will enable high accuracy mass imaging to surpass resolutions of 150 mm in commercial volumes.
Read More
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