Henkel Loctite Corp. has introduced Loctite Multicore MFR301, a no-clean sustained activity liquid flux designed for wave soldering PCBs, especially those with copper substrates.
Speedline Technologies Inc. has introduced MPM's next generation pump technology, a design that reduces materials costs, facilitates quick changeovers and expands the range of usable materials.
Fusion UV Systems launched its Light Hammer 10 (LH10), a high power 10-inch UV curing system, designed to provide a higher degree of conversion, higher speeds and better depth of cure than typically achieved with other UV sources.
Air Products and Chemicals Inc.'s Surfynol MD-20 molecular defoamer performs beyond just knockdown foam control, exhibiting high marks in other important areas such as macro and micro foam control, defoamer longevity, wetting defect reduction, wide compounding latitude and ease of handling.
Sartomer Co. has released Polyurethane Concepts, a 14-page technical booklet written for formulators of polyurethane coatings, adhesives, and elastomers.
Henkel Loctite Corp. has introduced Hysol QMI 519HT02, a silver-filled, high thermal conductivity die attach adhesive specifically formulated for use on die with high power densities.
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