EFD has introduced a new type of benchtop fluid dispenser that uses positive displacement technology to apply accurate, consistent amount of 2-part epoxies and other assembly fluids that change viscosity during the dispensing process.
TRA-BOND 789-3 is a high-strength, one-component adhesive designed for applications in the microelectronics industry that require good moisture resistance, like package sealing and substrate attach.
A new Filter-Regulator-Manifold (FRM) assembly kit from Nordson Corp. contains all of the parts required to supply the correct volumes of factory air to Nordson piston pump adhesive melters and pneumatic dispensing guns
Speedline Technologies, Inc. has announced that its MPM Gel-Flex conformal board support system reduced set up time by 50 percent in customer beta testing
In celebration of National Engineers Week 2004 (Feb. 22-28), the Society of Manufacturing Engineers (SME) has announced the release of new information resources that manufacturers can use to understand global manufacturing challenges, trends and opportunities
Manufacturers who use liquid filters can now save as much as 30 minutes of labor per changeout with a new easy-access, low maintenance filter design from RPA Process Technologies
CVC Specialty Chemicals, Inc. has created Epalloy 7192, an unmodified, high molecular weight Bisphenol A-based epoxy resin that is a semi-solid material at room temperature
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