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Advanced Applied Adhesives: Low Bleed Die Attach Adhesive
November 24, 2003
Advanced Applied Adhesives has announced the availability (in production quantities) of a new, low-bleed die attach adhesive. Designated AAA 1000, the material is a Teflon (PTFE) filled non-conductive paste specifically designed for tight tolerance die stacking. The 1000 is also suitable for many other applications where a soft non-abrasive electrical insulator is required. The low bleed property is achieved without sacrificing the superior properties of a BMI resin that has a proven track record of passing high JEDEC moisture level testing and 260 degrees C reflow. It also features enhanced adhesion for bottom die attach. 1000 bonds to a wide variety of organic, ceramic and metal substrates and is void-free even on moisture saturated solder mesh - even in snap cure mode. The adhesive can be cured on a heated indexer of a die bonder or in a snap cure oven to eliminate unproductive offline oven cure processes that are time consuming for multiple die stack application.