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Home » Topics » Adhesive & Sealant Products

Adhesive & Sealant Products
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Solar Compounds: Solarite Potting and Silicones

October 27, 2003
The Solarite SI-200 Series of Room Temperature Vulcanizing two-component, high-voltage electrical potting and casting silicones are available from the Solar Compounds Corp.
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Sealant Equipment & Engineering: Shot-A-Matic Dispense System

October 27, 2003
Shot-A-Matic System precisely dispenses large or small volumetric shots.
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Kaesar Compressors: Com-paK Plus

October 27, 2003
Kaeser Compressors Inc. announces the Com-paK Plus.
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G-P Resins: Rosin Ester Tackifier Dispersion

October 27, 2003
NovaRes AQ 1146, from Georgia-Pacific Resins Inc., is a rosin ester tackifier dispersion for use in pressure-sensitive waterborne adhesive formulations.
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Avery Dennison Corp: Expanded Fasson Laser Product Portfolio

October 27, 2003
Avery Dennison Corp. has expanded its laser product offering with the addition of Fasson LaserCopy Jet 300.
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I&J Fisnar: Scara Robot

October 27, 2003
The model TMB100 from I&J Fisnar Inc. is a quality choice when selecting a robot arm for a rotary work-cell or conveyor operation.
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Spiroflow Systems: Closure Bars for Hygienic Bulk Bag Discharger Applications

October 27, 2003
Spiroflow Systems' yoke closure bar system for its line of bulk bag dischargers increases operator safety and provides a hygienic way to control powder flow.
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Spectronic: UV Lamp

October 27, 2003
The Maxima ML-3500C UV lamp slashes the time it takes to cure adhesives, coatings, inks, epoxies, resins, printed circuit boards, plastics and other materials.
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DEK: Mass Imaging Process

October 21, 2003
DEK has successfully applied mass imaging techniques to improve the uniformity of Thermal Interface Material deposited between a silicon die and its package lid during semiconductor packaging processes.
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Henkel Loctite Corp: Dielectric Die

October 21, 2003
Henkel Loctite Corp. introduces Hysol QMI 550SI, a low-CTE, silica-filled, dielectric die attach adhesive designed to bond non-active package surfaces, such as bottom-die-to-substrates and die-to-dummy-spacer-die in same-size stacked die packages.
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