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Electronic components that contain a die require a path by which excess heat can be removed from the component package. In low-voltage plastic-encapsulated microcircuits, the heat may simply travel by conduction through the die attach and the die paddle for dissipation through the bottom of the package.

According to Grand View Research, the global market for wearable medical devices is expected to reach $27.8 billion by 2022.1 Dow Corning reportedly sees the role of specialized adhesive technologies as a key driver of this growth, especially in skin- adhered medical devices, a major segment of the wearables market.

From April 3-6, exhibitors, industry members and experts will travel to Nuremberg, Germany, to attend the European Coatings Show (ECS). The event will feature seven exhibition halls, multiple conference sessions, a keynote speaker, and two networking events.

LOCTITE HF 2W is a tin-lead, water-washable solder paste designed for high-throughput, high-yield production.

This company recently introduced active alignment (AA) adhesives designed for camera module assembly.

This company now offers Dymax SpeedMask 9-7001.

A new reworkable edgebond adhesive* from Zymet has been shown to enhance the board-level reliability of a large wafer-level chip-scale package (WLCSP).  The work was performed in a collaborative effort between Portland State University, Cisco, and Zymet, and published in the Proceedings of the SMTA International 2016 conference, which took place in Rosemont, Ill.

The global electronic adhesives market is expected to grow at a compound annual growth rate (CAGR) of close to 10% from 2017-2021, according “Global Electronic Adhesives Market 2017-2021,” a recent report from Technavio.

This company has developed a fast-curing, electrically conductive, thin film adhesive.