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NewsAdhesives and Sealants TopicsAdhesives & Sealants HeadlinesCuring

RadTech Issues Call for Papers

Abstract submission is due by September 24, 2021.

event speaker
June 28, 2021

RadTech International North America is accepting abstracts for the 2022 RadTech UV+EB Technology Conference & Exposition, scheduled for May 10-12, 2022, at the Hyatt Regency Orlando in Orlando, Fla. The organization seeks high-quality technical papers that discuss advances in: LED Technology, Additive Manufacturing/3D Printing, Electron Beam, Coatings, Materials, Adhesives, Inks, Formulation, Chemistry, Equipment, Testing, and more.

Technical papers should be no longer than 25 minutes in length, with five minutes for Q&A. Completion of the online Abstract Submission Form is due by September 24, 2021. Descriptions should be sufficiently comprehensive to enable the Conference Committee to assess the scope and content of the paper. The committee will select papers, and speakers will be notified by November 2021.

For more information, visit www.radtech2022.com/call-for-papers.

KEYWORDS: education electron beam (EB) curing events innovation LED curing ultraviolet (UV) curing

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