Encapsulant - Articles - Page 2 | Adhesives & Sealants Industry

Fiber Optic Center Adds Hernon Epoxy

Fiber Optic Center Inc. recently announced the addition of Hernon Tuffbond 302 epoxy adhesive to its epoxy line.

August 24, 2016

The epoxy reportedly performs under temperature cycling from -54°C to 85°C.

HENKEL ADHESIVE TECHNOLOGIES: Thermally Conductive Adhesive

April 12, 2016

This company has developed a thermally conductive Technomelt material.

Creative Materials Acquires Noelle Industries

September 3, 2015

Creative Materials Inc. recently announced the acquisition of Noelle Industries, a manufacturer of encapsulants, potting compounds, adhesives and coatings.

ELLSWORTH ADHESIVES EUROPE: Blog

July 7, 2015

This company has launched a new blog.

ELLSWORTH ADHESIVES EUROPE: Dow Corning Encapsulant

November 26, 2014

This company now offers Dow Corning’s EE-3200 low-stress silicone encapsulant, a product designed for the solar power industry.

HENKEL CORP.: Encapsulants

April 7, 2014

LOCTITE ECCOBOND EN 3810T and 3838T are novel encapsulant formulations that can be selectively applied to environmentally susceptible components.

NUSIL TECHNOLOGY LLC: Silicone Products

February 15, 2013

This company’s Engineering and Electronics business unit debuted two new silicone products in San Francisco at Photonics West 2013.

HENKEL: Electronics Encapsulant

April 9, 2012

This company’s low-pressure molding MACROMELT technology portfolio has been expanded to include a material designed specifically for high thermal stability and chemical resistance.