Adhesives in electrical/electronic - Articles - Page 44

Top 5 News that Sticks

News on Isoprene Market Receives Most Reader Clicks

Last week, news on the isoprene market received the most reader interest.

May 15, 2017

This weekly roundup highlights the adhesives, sealants and coatings news stories that garnered the most attention during the previous week on our website, as well as our eNewsletter and social media platforms.

Henkel Announces Automotive Electronics Sealing Webinar

The automotive industry is increasingly calling for electrical and electronic parts to be completely sealed against the environment.

May 11, 2017

Henkel recently announced a webinar on Loctite impregnation solutions (LIS) for sealing automotive electronics.

MASTER BOND: Epoxy System

March 16, 2017

Supreme 3HTND-2DM is a rapid-curing, toughened, one-part epoxy system used for the dam-and-fill method for chip-on-board encapsulation.

Abramovich Appointed Head of Henkel Sales

Previously vice president of channel management, Abramovich has 30 years of sales and marketing experience.

March 1, 2017

Steven Abramovich has been named head of sales, Americas, for its electronics business.

HENKEL: Solder Paste

February 27, 2017

LOCTITE HF 2W is a tin-lead, water-washable solder paste designed for high-throughput, high-yield production.

Nordson Acquires German Soldering Company

Nordson Corp. recently announced it has acquired InterSelect GmbH.

February 22, 2017

InterSelect GmbH is a German designer and manufacturer of selective soldering systems used in various electronics assembly applications.

H.B. FULLER: Active Alignment Adhesives

February 17, 2017

This company recently introduced active alignment (AA) adhesives designed for camera module assembly.

ELLSWORTH ADHESIVES EUROPE: Dymax Adhesive

February 8, 2017

This company now offers Dymax SpeedMask 9-7001.

Advancing Adhesives

On the Bonding Edge

A new reworkable edgebond adhesive enhances board-level reliability of large WLCSP.

February 1, 2017

A new reworkable edgebond adhesive* from Zymet has been shown to enhance the board-level reliability of a large wafer-level chip-scale package (WLCSP). The work was performed in a collaborative effort between Portland State University, Cisco, and Zymet, and published in the Proceedings of the SMTA International 2016 conference, which took place in Rosemont, Ill.

Market Trends

Continued Growth for Adhesives in Electronics

The use of electronic adhesives in PCBs continues to grow.

February 1, 2017

The global electronic adhesives market is expected to grow at a compound annual growth rate (CAGR) of close to 10% from 2017-2021, according “Global Electronic Adhesives Market 2017-2021,” a recent report from Technavio.