Nordson ASYMTEK’s Select Coat SL-940 conformal coating platform will feature a new flow control system being introduced at SMTAI.
September 10, 2019
Nordson ASYMTEK, a Nordson company, reports that it will present ways to create reliable, efficient conformal coating and dispensing processes at SMTA International (SMTAI) 2019, which will be held September 24-26.
The Pressure Sensitive Tape Council (PSTC) recently announced its call for abstracts for the opportunity to present during the Building & Construction Industry: Markets and Applications Track at its upcoming annual event, the historically known Tape Summit, taking place in Orlando, Fla., May 6-9, 2020.
Henkel materials specialists have reportedly developed novel formulations that allow for large-scale production at high speed, reduce the risk of thermal event-related safety concerns, and enable various battery architectures.
September 6, 2019
At the 2019 Electric & Hybrid Vehicle Technology Expo, which will be held September 10-12 in Novi, Mich., Henkel reports that it will display its latest material technologies for cost-effective high-volume assembly, protection, and thermal control of next-generation electric vehicle (EV) battery systems.
Speaker abstracts for the 2020 World Adhesive & Sealant Conference should be submitted online by August 30.
August 28, 2019
Interested parties are invited to share their knowledge and innovations on a range of topics at the 2020 World Adhesive & Sealant Conference, which will be held April 20-22 in Chicago.
According to PPG, its Teslin substrate is a durable, secure, and easy-to-print synthetic material that excels in applications that demand a tough, high-performance label solution.
August 27, 2019
PPG recently announced that it will showcase PPG TESLIN® substrate for adhesive coaters, label converters, and packaging specialists during Labelexpo Europe 2019, which will be held September 24-27 in Brussels, Belgium.
Michelman reports that its low-VOC architectural coatings enhance scuff, scrub, scratch, burnish, and abrasion resistance.
August 26, 2019
Michelman, a bronze sponsor and exhibitor at Coating Trends & Technologies (CTT) 2019, recently announced that it will feature its line of sustainable waterborne surface modifiers for improving the performance of exterior wood coatings and architectural paint coatings.
The investigation reportedly shows that reworkable adhesives can enhance the board-level reliability of large WLPs, even for harsh environment applications.
August 23, 2019
At the SMTA International 2019 technical conference, which will be held September 22-26 in Rosemont, Ill., Portland State University and Zymet will present their investigations on enhancing the board-level reliability of large wafer-level packages (WLPs) for harsh environment applications.
The expansion of the foodservice industry, along with the emergence of “takeaway” and “grab-and-go” services, will continue to provide potential growth prospects for the compostable foodservice packaging market.
August 23, 2019
Worldwide sales of compostable foodservice packaging reached approximately 6,400 tons worth $16.7 million in 2018; the market is projected to grow at a CAGR of around 5% through 2029.
ASC’s interactive new Emerging Leaders Workshop will include facilitated discussion and be structured to optimize learning between peers, providing tools and strategies for leveraging personal strengths and leading change.
August 19, 2019
Consistent with the theme of “Focus on the Future,” the Adhesive and Sealant Council (ASC) is introducing an Emerging Leaders Workshop to its Executive Leadership Conference programming.
Jiangang (Jack) Zhao, Ph.D., applications director and chief scientist, presented original data and discussed typical plasma applications that enable or improve process steps for wafer-level packaging (WLP).
August 16, 2019
Nordson MARCH, a Nordson company, recently presented a paper entitled “Plasma Applications for Wafer Level Packaging, Part 1,” at the 20th annual International Conference on Electronic Packaging Technology (ICEPT) in Hong Kong.