Events - Articles - Page 25 | Adhesives & Sealants Industry

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Henkel Presence at IPC APEX EXPO 2022 to Feature Materials for Consumer and Industrial Electronics Applications

IPC APEX EXPO 2022 is taking place January 22-27 in San Diego, Calif.

January 25, 2022

Henkel’s exhibit and paper presentations at IPC APEX EXPO 2022 will showcase solutions addressing the requirements across market sectors for increased reliability and sustainability.

Registration Opens for RadTech 2022

The event will feature more than 100 presentations covering the latest industry innovations.

January 24, 2022

Organizers announced that registration is open for RadTech UV+EB Technology Expo & Conference 2022, which will be held May 9-12 in Orlando, Fla.

Program Released for 45th Adhesion Society Annual Meeting

The Adhesion Society is also offering a short course on adhesion science and technology two days before the start of the meeting.

January 19, 2022

The program for the 45^th Annual Meeting of the Adhesion Society has been released.

Electronics Industry to Gather at IPC APEX EXPO 2022

IPC APEX EXPO returns as an in-person event January 22-27 in San Diego, Calif.

January 12, 2022

IPC APEX EXPO 2022 will welcome the electronics manufacturing community to the San Diego Convention Center in San Diego, Calif., on January 22-27. The largest North American event for the electronics manufacturing industry is expected to draw approximately 9,000 attendees from 45 countries.

TRFA Issues Call for Papers for 2022 Annual Meeting

The meeting is scheduled to take place in Dallas, Texas, May 2-5, 2022.

January 7, 2022

The Thermoset Resin Formulators Association (TRFA) is inviting industry professionals to submit technical papers for its 2022 Annual Meeting.

Nordson to Demonstrate Semiconductor Packaging Solutions at SEMICON Taiwan 2021

SEMICON Taiwan 2021 will take place December 28-30 in Taipei.

December 20, 2021

Nordson Corp. recently announced that it will demonstrate its latest solutions for semiconductor packaging and electronics manufacturing at SEMICON Taiwan in Taipei.

Registration Opens for Adhesion Society Annual Meeting

The meeting will be held in San Diego, Calif., February 20-23, 2022.

December 16, 2021

Interested individuals are invited to register to attend the 45^th Annual Meeting of the Adhesion Society.

Deadline Nears for WAC 2022 Speaker Abstracts

The conference provides stakeholders in the adhesive and sealant industry an opportunity to present their expertise and innovations.

December 8, 2021

Organizers are accepting speaker abstracts through January 7 for the World Adhesive and Sealant Conference, which will be held April 25-27 in Chicago.

Nordson Demonstrates Solutions for SMT Technology and Electronics Manufacturing at NEPCON ASIA 2021

The company featured technologies and products from the Nordson Electronics Solutions and Nordson Test & Inspection divisions.

November 12, 2021

Nordson Corp. recently announced that it showcased solutions for electronics manufacturing, printed circuit board assembly (PCBA), surface mount technology (SMT), and semiconductor packaging at the NEPCON Asia tradeshow in Shenzhen, China.