Adhesive & Sealant Products

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Born2Bond™ Ultra K85 from Bostik is an instant engineering adhesive processed from 60% bio-based raw materials that offers exceptional heat and humidity resistance. 

Berquist Liqui Form TLF 6500 CGel-SF is an upgraded thermal curable gel designed to push the envelope of ADAS applications.

LG Chem has co-developed a high-performance silver paste with Japan’s Noritake that is designed specifically for bonding silicon carbide (SiC) chips to substrates in automotive power semiconductors. 

Creative Materials Inc. recently launched a series of multi-purpose conductive epoxies that combine flexibility with fine-line precision and extreme durability.

Powerful PUR hot-melt adhesives are essential for the lamination of textiles, nonwovens, foam materials, membranes, and other fabrics.

Pressure-sensitive adhesive tapes from Avery Dennison Performance Tapes help secure structures against the elements.

Toyochem has developed quick-cure technology that eliminates the aging process, resulting in faster processing speeds.

A new thermally conductive gap filler for applications in power electronics, SEMICOSIL^® 9649 TC is a silicone product that can withstand high thermal stresses. 

ROSS VCB-10 V-Blenders are designed for precision mixing of free-flowing solids. 

Avery Dennison Yongle’s new generation of PVC 2.0 low-VOC tapes are engineered for automotive interiors and environments where low fogging, low odor, and low emissions are required.