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Home » Topics » End User » Info for Electronics

Info for Electronics
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NORDSON ASYMTEK: Dispensers

July 1, 2014
The new Spectrum™ II Cleanroom Series of fluid dispensers was reportedly created for applications that are sensitive to contamination by submicron-sized particles.
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PPG Adds SEMCO Packaging Capabilities at French Site

June 26, 2014
PPG Industries recently announced it has begun operation of a new packaging unit installed at its Gonfreville, France, coatings plant and aerospace application support center.
Read More

Fishman Receives Manufacturing Leadership Product Award

June 25, 2014
Fishman Corp. recently announced it has received the 2014 Frost and Sullivan Manufacturing Leadership Award.
Read More

DELO: Epoxy Adhesive

June 18, 2014
A heat-curing adhesive that reportedly cures to full strength in temperatures as low as 60°C is now available.
Read More

NORDSON MARCH: Plasma Treatment System

June 6, 2014
This company, a Nordson® company, has introduced its new FlexVIA-Plus™ plasma treatment system.
Read More

Automation in the Metering, Mixing and Dispensing of Adhesives and Sealants

Diverse automation and manual metering, mixing,and dispensing options are necessary to suit a variety of industrial applications.
Mark Sorenson
June 2, 2014

Manufacturers are demanding increasingly robust and cost-effective solutions when facing challenges in bonding, potting, and form-in-place gaskets. As a result, two-part fluids are increasingly being specified to provide higher quality, consistency and endurance.


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Rapid Adhesive Bonding by Induction and Microwave Curing

Induction and microwave curing procedures must be evaluated and customized according to the specific application.
Arno Maurer
June 2, 2014

Adhesive bonding in industrial production often requires very short curing times. In the case of reactive adhesives, this generally means high curing temperatures.


Read More

Advancements in UV LED Curing Technology for Adhesives

The gaps that previously existed between traditional lamp solutions and UV LED-based curing systems have been narrowed.
Pamela Lee
June 2, 2014

Assembly and manufacturing processes are highly dependent on the rapid and effective curing of ultraviolet (UV) adhesives. Historically, mercury arc lamps have been used as the curing source in a wide range of industrial applications and processes to polymerize adhesives.


Read More

AI TECHNOLOGY INC.: Die-Attach Film

May 29, 2014
This company has released a new electrically and thermally conductive 20-micron wafer level die-attach film (DAF).
Read More

Apple and Samsung Continue to Dominate Worldwide Branded Tablet Shipments

May 23, 2014
More than 41 million branded tablets shipped worldwide in the first quarter of 2014, according to ABI Research.
Read More
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