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NewsAdhesives and Sealants TopicsAdhesives & Sealants HeadlinesCuring

RadTech 2022 Opens Call for Papers

The event is scheduled for May 10-12, 2022, at the Hyatt Regency Orlando in Orlando, Fla.

event speakers and presenters

Credit: kasto80 / iStock / Getty Images Plus via Getty Images

August 4, 2021

RadTech International North America recently announced that it is accepting abstracts for the 2022 RadTech UV+EB Technology Conference & Exposition, scheduled for May 10-12, 2022, at the Hyatt Regency Orlando in Orlando, Fla. Organizers are seeking high-quality technical papers that discuss advances in LED technology, additive manufacturing/3D printing, electron beam, coatings, materials, adhesives, inks, formulation, chemistry, equipment, testing, and more.

Technical papers should be no longer than 25 min in length, with five minutes for Q&A, and the online Abstract Submission Form should be completed prior to September 24, 2021. Descriptions should be sufficiently comprehensive to allow assessment of the scope and content of papers by the Conference Committee. The committee will select papers, and speakers will be notified by November 2021 whether or not they have been selected.

For more information, visit www.radtech2022.com/call-for-papers.

KEYWORDS: education events innovation

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