Nordson Electronics Solutions recently announced that it will showcase its latest dispensing, conformal coating, and selective soldering equipment for printed circuit board assembly in two stands at the SMTConnect trade fair. The event will be held in Nuremberg, Germany, May 10-12, 2022.

In the Fraunhofer Future Packaging Line (Hall 5, Stand 434), the ASYMTEK Vantage^® system will be dispensing underfill fluid as part of the production line running at the trade fair.  

In the SmartTec stand (Hall 4, Stand 210), experts will be available to discuss the latest solutions for conformal coating, fluid dispensing, and selective soldering. Equipment on display will include:

• The ASYMTEK Forte^® dispensing platform, jetting surface-mount adhesive with the IntelliJet^® jetting system
• The ASYMTEK Select Coat^® conformal coating system for quality and process control in conformal coating operations
• The ASYMTEK FX-940 ACI/AOI conformal coat inspection system

Learn more at www.nordson.com.