Toyochem Co. Ltd. the polymer materials division of Japan’s artience Group, is expanding the global availability of its Labelmelt™ series of its alkali-soluble hot-melt adhesives for roll-fed film labels.
A new polyolefin polymer technology enables advanced hot-melt formulations designed to deliver significant performance improvements across multiple dimensions.
Tecbond 114 from Power Adhesives has been developed for use on uncoated cardboard, making it ideal for carton closing, tray assembly and for use with packaging inserts.
The adhesives and sealants industry is driven by need to provide customers with products that improve manufacturing processes and offer stronger and more sustainable bonding.
A renewable raw material can be effectively incorporated into a hot-melt formulation with the objective of not only increasing the renewable content of the adhesive but also maintaining high performance standards.
Aware of the need to develop adhesives that are increasingly efficient and environmentally respectful, AIMPLAS has been actively involved in projects aimed at improving adhesive technologies.