Articles Tagged with ''adhesives in electrical/electronic''

IPC, the global electronics manufacturing industry association, recently sent a letter to U.S. President Donald Trump, Mexican President Andrés Manuel López Obrador, and Canadian Prime Minister Justin Trudeau, urging them to launch a trilateral initiative to mobilize industrial base support for the continuing medical response related to COVID-19. 

A global emphasis on working from home, combined with advice to minimize COVID-19 transmission from shared surfaces even within a home, will help cement the benefits of smart home voice control for millions of consumers.

Toyochem Co., Ltd., a member of the Toyo Ink Group, has launched a flexible electromagnetic interference (EMI) shielding film, LIOELM TSS510-HF, designed to meet the performance requirements of 5G flexible printed circuits (FPCs).

Master Bond EP21TPHT is a new two-component epoxy polysulfide system designed for bonding applications that require toughened and thermally stable bonds that are resistant to chemicals.

Panacol recently announced that it has launched Vitralit UC 1536, a low-halogen UV adhesive for the electronics industry.

EpoxySet recently announced that it supplies EC-1012M/EH-20 flame-resistant potting compound for protecting power supplies, high-voltage batteries, coil windings, transformers, PC boards, and other electronic devices.

According to a recent IPC survey, electronics manufacturers continue to feel the impact of COVID-19 on their businesses.

Electric vehicles (EVs) have been rapidly adopted in recent years, and the rate of market growth has shown to be significantly higher than that of the fuel-injected automotive market. Indeed, the global stock of electric cars surpassed five million in 2018.

Premixed and frozen (PMF) refers to plural-component resin systems delivered in syringes and cartridges that are premixed and frozen in dry ice.

Every four years, the adhesives and sealants community gathers at the World Adhesive and Sealant Conference (WAC) to explore opportunities for education, networking, and growth. This year’s event, hosted by the Adhesive and Sealant Council (ASC) and co-organized by the Asia Regional Adhesive Council (ARAC) and FEICA (association of the European Adhesive and Sealant Industry), will be held April 20-22 at the Chicago Hilton in Chicago, Ill.