The Pan Pacific Microelectronics Symposium reportedly promotes international technical interchange and provides a forum for networking among microelectronics professionals and business leaders throughout the world.
SMTA recently announced that the program is finalized for its 25th Annual Pan Pacific Microelectronics Symposium, which will take place February 10-13, 2020, at the Westin Hapuna Beach Resort on the Big Island of Hawaii.
Products displayed at the Bostik booth included removable labels, linerless labels, food direct contact labels, and wash off labels.
Bostik recently announced that it showcased a wide range of solutions and technologies for the tapes and labels industry at the recent LabelExpo Asia 2019.
Submissions should be received by December 20 to qualify for consideration.
Organizers of UTECH North America 2020, a polyurethanes conference and trade show that will take place May 19-21 in Chicago, have announced a call for papers.
New, first-time RadTech conference sessions include Industry 4.0, Exterior Coatings, Dual Cure, and Micro-patterning.
With a focus on 3D printing, new materials, UV LEDs, and sustainability, RadTech has announced the conference program for RadTech UV+EB Technology Expo and Conference 2020, which will be held March 8-11 at the Disney Coronado Springs in Orlando, Fla.
PSTC reports that the reinvigorated event will offer a record number of networking opportunities, expanded educational opportunities, and an optimized schedule.
The Pressure Sensitive Tape Council (PSTC) recently officially announced the rebranding of its historically named Tape Summit to Tape Week.
The ASSEMBLY Show will provide thousands of attendees with numerous opportunities to learn from industry experts, explore the latest products and technologies, and network throughout the three-day event.
The manufacturing community will assemble October 22-24 at the Donald E. Stephens Convention Center in Rosemont, Ill., for the seventh annual ASSEMBLY Show.
Vince Lombardi famously said, “Leaders are made, they are not born. They are made by hard effort, which is the price which all of us must pay to achieve any goal that is worthwhile.”
One of the main threads through FEICA 2019 was reportedly how innovations in adhesives and sealants can help solve some of the biggest issues facing the world by improving product efficiency and circularity, thus creating a more sustainable society.
According to event organizers, 650 participants from 34 countries attended the 2019 FEICA Conference and Expo September 11-13 to discuss the European adhesive and sealant industry’s sustainable supply chain management, market drivers and trends, innovative solutions, and technological advancements.