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Home » events

Articles Tagged with ''events''

asi1018-ASSEMBLY-img

The Assembly Show Returns to Chicago

The Assembly Show will once again offer three days of educational sessions, exhibits, a dynamic keynote speaker, and plenty of networking.
October 9, 2018

Assembly industry enthusiasts will connect from October 23-25 at The Assembly Show, taking place at the Donald E. Stephens Convention Center in Rosemont, Ill.


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Assembly Show

Record Attendance at FEICA European Adhesive & Sealant Conference

600 participants from 35 countries attended the 2018 FEICA Conference and Expo.
September 24, 2018

The FEICA European Adhesive & Sealant Conference and Expo saw a record number of delegates attend this year’s event.


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Assembly Show

RadTech Announces Big Ideas Conference

The conference is taking place March 19-20, 2019, in Redondo Beach, Calif.
August 1, 2018

RadTech recently announced a new conference in 2019 called BIG IDEAS for UV+EB Technology.


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FEICA Conference

Latvia Hosts 2018 FEICA European Adhesive & Sealant Conference and Expo

Adhesives and sealants industry leaders will gather to discuss the latest technologies and trends from September 12-14 in Riga, Latvia.
June 1, 2018
Adhesives and sealants industry leaders will gather to discuss the latest technologies and trends.
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RadTech 2018

Innovations in Curing Adhesives and Sealants

RadTech 2018 will include 100 presentations on the latest UV and EB technologies, as well as an exhibition.
May 1, 2018
RadTech 2018, the biennial global conference on the ultraviolet (UV) and electro-beam (EB) curing industry, will take place May 7-9 in Rosemont, Ill. The three-day conference will include more than 100 presentations detailing the latest information in UV and EB technology, including 3D printing, UV LEDs, packaging/printing, automotive markets, flooring, and more. In addition, a global market overview session will take place. In this session, representatives from leading companies will present market overview data from North America, China, and Europe.
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Foam Expo 2018

Foam Expo North America Show Wrapup

The second annual Foam Expo event attracted international interest with an expo and conference program.
May 1, 2018
The second annual Foam Expo and Conference took place March 6-8 in Novi, Mich. The event featured 291 exhibitors displaying cutting-edge technologies and concepts to 4,859 visitors who spanned the technical foam manufacturing supply chain. The event attracted considerable international interest, with attendees flying in from Mexico, Japan and China, as well as the U.S. and Canada.
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ASC 2018

From the ASC President: Gather with the Adhesives and Sealants Industry in Miami

The ASC 2018 Annual Spring Convention and Expo provides opportunities to learn, share, and network with industry professionals.
Bill Allmond
April 2, 2018
I am pleased to share exciting details about the ASC 2018 Annual Spring Convention and Expo. As you know, this annual event is the largest U.S. gathering of adhesive and sealant professionals.
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ASC Keynote speakers

FEICA Announces Keynote Speakers

The business forum plans to explore the implications of the digital age for business and strive to identify practical strategies that will help adhesive and sealant companies to succeed in this new era.
March 29, 2018

FEICA recently announced the keynote speakers in the business forum “Adhesives and Sealants in the digital age,” taking place during the 2018 European Adhesive & Sealant Conference and Expo.


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Assembly Show

Global Adhesive Tape Summit Announced

The event has a working program built around 26 lectures by industry experts.
March 28, 2018

Afera, the European Adhesive Tape Association, recently announced its launch of the 1st Global Adhesive Tape Summit.


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Jürgen-Wegner,-PhD,-Chemquest-Europe-at-in-adhesives-symposium

in-adhesives Symposium a Success

Topics discussed included automotive, lightweight, medical science/health and natural resources.
March 21, 2018

Over 100 delegates from 21 countries participated in the symposium on adhesives and industrial adhesives technology.


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