Articles Tagged with ''events''

Deadline for World Adhesive & Sealant Conference Abstracts is August 30

Speaker abstracts for the 2020 World Adhesive & Sealant Conference should be submitted online by August 30.

August 28, 2019

Interested parties are invited to share their knowledge and innovations on a range of topics at the 2020 World Adhesive & Sealant Conference, which will be held April 20-22 in Chicago.

PPG to Showcase Label Solutions at Labelexpo Europe 2019

According to PPG, its Teslin substrate is a durable, secure, and easy-to-print synthetic material that excels in applications that demand a tough, high-performance label solution.

August 27, 2019

PPG recently announced that it will showcase PPG TESLIN^® substrate for adhesive coaters, label converters, and packaging specialists during Labelexpo Europe 2019, which will be held September 24-27 in Brussels, Belgium.

Michelman to Feature Range of Sustainable Surface Modifiers for Exterior Wood and Architectural Coatings at Coatings Trends & Technologies

Michelman reports that its low-VOC architectural coatings enhance scuff, scrub, scratch, burnish, and abrasion resistance.

August 26, 2019

Michelman, a bronze sponsor and exhibitor at Coating Trends & Technologies (CTT) 2019, recently announced that it will feature its line of sustainable waterborne surface modifiers for improving the performance of exterior wood coatings and architectural paint coatings.

Zymet and Portland State to Present on Reworkable Adhesives for Wafer-Level Packages at SMTA International Conference

The investigation reportedly shows that reworkable adhesives can enhance the board-level reliability of large WLPs, even for harsh environment applications.

August 23, 2019

At the SMTA International 2019 technical conference, which will be held September 22-26 in Rosemont, Ill., Portland State University and Zymet will present their investigations on enhancing the board-level reliability of large wafer-level packages (WLPs) for harsh environment applications.

Compostable Food Service Packaging Sales to Grow as Sustainability Push Promises Rapid Adoption

The expansion of the foodservice industry, along with the emergence of “takeaway” and “grab-and-go” services, will continue to provide potential growth prospects for the compostable foodservice packaging market.

August 23, 2019

Worldwide sales of compostable foodservice packaging reached approximately 6,400 tons worth $16.7 million in 2018; the market is projected to grow at a CAGR of around 5% through 2029.

ASC Adds Emerging Leaders Workshop to Executive Leadership Conference Offerings

ASC’s interactive new Emerging Leaders Workshop will include facilitated discussion and be structured to optimize learning between peers, providing tools and strategies for leveraging personal strengths and leading change.

August 19, 2019

Consistent with the theme of “Focus on the Future,” the Adhesive and Sealant Council (ASC) is introducing an Emerging Leaders Workshop to its Executive Leadership Conference programming.

Nordson MARCH Presents Paper on Plasma Applications for Wafer-Level Packaging at ICEPT

Jiangang (Jack) Zhao, Ph.D., applications director and chief scientist, presented original data and discussed typical plasma applications that enable or improve process steps for wafer-level packaging (WLP).

August 16, 2019

Nordson MARCH, a Nordson company, recently presented a paper entitled “Plasma Applications for Wafer Level Packaging, Part 1,” at the 20th annual International Conference on Electronic Packaging Technology (ICEPT) in Hong Kong.

Sika Automotive to Participate in Global Automotive Lightweight Materials Detroit Conference

Leslie Wolschleger, Ph.D., Sika’s vice president of Research & Development, will give a presentation focused on the “Evolution of Adhesive Joining in Automotive Body-in-White.”

August 14, 2019

Sika Automotive recently announced that it will serve as the headline sponsor, as well as a presenter and an exhibitor at the Global Automotive Lightweight Materials Detroit 2019 Conference, which will be held August 20-22 in Detroit, Mich.

Dow Announces Plans to Explore Big Issues at K 2019 Event

During the event, Dow reports that it will showcase a wide variety of products while sharing its approach to global issues.

August 13, 2019

Dow recently announced that it is looking to encourage debate across the industry at K 2019, which will be held October 16-23, 2019 in Düsseldorf, Germany.

Avery Dennison to Demonstrate Multiple New Products at Labelexpo Europe

The theme of Avery Dennison’s presence at Labelexpo Europe is “Making a Material Difference.”

July 18, 2019

Avery Dennison recently announced that it will create its biggest-ever trade show presence at Labelexpo Europe 2019, which will be held in Brussels from September 24-27.

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