Articles Tagged with ''events''

event speakers and presenters

PSTC Opens Call for Abstracts for 2020 Annual Event

The deadline to submit abstracts is September 25.
September 9, 2019

The Pressure Sensitive Tape Council (PSTC) recently announced its call for abstracts for the opportunity to present during the Building & Construction Industry: Markets and Applications Track at its upcoming annual event, the historically known Tape Summit, taking place in Orlando, Fla., May 6-9, 2020.


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Henkel EV battery pack materials

Henkel to Debut Electric Vehicle Battery Material Solutions at the Electric & Hybrid Vehicle Technology Expo

Henkel materials specialists have reportedly developed novel formulations that allow for large-scale production at high speed, reduce the risk of thermal event-related safety concerns, and enable various battery architectures.
September 6, 2019

At the 2019 Electric & Hybrid Vehicle Technology Expo, which will be held September 10-12 in Novi, Mich., Henkel reports that it will display its latest material technologies for cost-effective high-volume assembly, protection, and thermal control of next-generation electric vehicle (EV) battery systems.


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Green living

Michelman to Feature Range of Sustainable Surface Modifiers for Exterior Wood and Architectural Coatings at Coatings Trends & Technologies

Michelman reports that its low-VOC architectural coatings enhance scuff, scrub, scratch, burnish, and abrasion resistance.
August 26, 2019
Michelman, a bronze sponsor and exhibitor at Coating Trends & Technologies (CTT) 2019, recently announced that it will feature its line of sustainable waterborne surface modifiers for improving the performance of exterior wood coatings and architectural paint coatings.
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Zymet SMTA International conference

Zymet and Portland State to Present on Reworkable Adhesives for Wafer-Level Packages at SMTA International Conference

The investigation reportedly shows that reworkable adhesives can enhance the board-level reliability of large WLPs, even for harsh environment applications.
August 23, 2019
At the SMTA International 2019 technical conference, which will be held September 22-26 in Rosemont, Ill., Portland State University and Zymet will present their investigations on enhancing the board-level reliability of large wafer-level packages (WLPs) for harsh environment applications.
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Market-Trends

Compostable Food Service Packaging Sales to Grow as Sustainability Push Promises Rapid Adoption

The expansion of the foodservice industry, along with the emergence of “takeaway” and “grab-and-go” services, will continue to provide potential growth prospects for the compostable foodservice packaging market.
August 23, 2019

Worldwide sales of compostable foodservice packaging reached approximately 6,400 tons worth $16.7 million in 2018; the market is projected to grow at a CAGR of around 5% through 2029.


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Raised-Hands

ASC Adds Emerging Leaders Workshop to Executive Leadership Conference Offerings

ASC’s interactive new Emerging Leaders Workshop will include facilitated discussion and be structured to optimize learning between peers, providing tools and strategies for leveraging personal strengths and leading change.
August 19, 2019
Consistent with the theme of “Focus on the Future,” the Adhesive and Sealant Council (ASC) is introducing an Emerging Leaders Workshop to its Executive Leadership Conference programming.
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Electronics_Generic

Nordson MARCH Presents Paper on Plasma Applications for Wafer-Level Packaging at ICEPT

Jiangang (Jack) Zhao, Ph.D., applications director and chief scientist, presented original data and discussed typical plasma applications that enable or improve process steps for wafer-level packaging (WLP).
August 16, 2019
Nordson MARCH, a Nordson company, recently presented a paper entitled “Plasma Applications for Wafer Level Packaging, Part 1,” at the 20th annual International Conference on Electronic Packaging Technology (ICEPT) in Hong Kong.
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Raised-Hands

Sika Automotive to Participate in Global Automotive Lightweight Materials Detroit Conference

Leslie Wolschleger, Ph.D., Sika’s vice president of Research & Development, will give a presentation focused on the “Evolution of Adhesive Joining in Automotive Body-in-White.”
August 14, 2019
Sika Automotive recently announced that it will serve as the headline sponsor, as well as a presenter and an exhibitor at the Global Automotive Lightweight Materials Detroit 2019 Conference, which will be held August 20-22 in Detroit, Mich.
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