Adhesives and Sealants Topics

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Intel has announced plans for an initial investment of more than $20 billion in the construction of two new chip factories in Ohio.

A self-adhesive, reusable, and compressible sleeve, tesa^® Twinlock can reportedly help packaging printers achieve greater operational efficiency and improve return on investment while reducing the solid waste associated with packaging printing.

The DuPont Microcircuit and Components Materials (MCM) business has announced a strategic collaboration with Kuprion Inc. to launch the ActiveCopper™ thick film paste suite of products to the electronics industry.

The past year has brought an unprecedented combination of factors that have worked together to impact the supply chain, in some cases severely. The industry’s sustained resolve in navigating this onslaught of material shortages, logistics challenges, and other issues has been impressive. It is unfortunately looking like all of that determination, ingenuity, and flexibility will be required well into 2022.

The Society of Chemical Manufacturers & Affiliates (SOCMA) has confirmed that the Specialty & Custom Chemicals Show will be held February 28-March 2 at the Omni in Fort Worth, Texas.

Mactac^®, a LINTEC company, has entered into an agreement to purchase the assets of Spinnaker Coating, LLC.

Nynas has settled the payment in full to trade creditors that had claims remaining after they received an initial payment following the completion of Nynas’ company reorganization in January 2021.

Huntsman has launched its ARALDITE^® 2080 adhesive, a low-odor, non-flammable (according to CLP, flashpoint > 60°C), and primer-free structural acrylate adhesive.