PAM Fastening Technology introduces an improved hot-melt
cartridge applicator with a large 3-mm extension nozzle and increased heating
in the nozzle block area of the gun for easier spraying or improved extrusion
of the adhesive.
To
address the thermal requirements posed by smaller-outline, higher-functioning-power
semiconductor devices, Henkel has formulated an advanced die attach solder
paste suitable for both high-lead and lead-free applications.
TECTOSIL®, a new thermoplastic encapsulant for the manufacture of photovoltaic modules, provides sensitive solar cells with effective and long-lasting protection against mechanical and chemical stresses.
Pressurex® pressure-indicating film from Sensor Products reveals the distribution of surface contact pressures in cores, composite lay-ups and bonded surfaces.
Scott Bader has
launched a new Web site covering the range of products and services offered by
its adhesives, composites, and specialty polymers business units globally.
Tri-Mer Corp, a manufacturer of air pollution systems for difficult gases and particulates, recently introduced the MultiPhase BioSystem, a new advancement in “green” technology for VOC control.
Pecora’s “Security Sealant Systems” handbook serves as a reference manual that explains how a systems approach to security sealants allows the applicator to achieve the necessary hardness strength to significantly reduce the risk of tampering combined with the joint movement levels a building requires.
Brookfield Engineering is celebrating 75th Anniversary
by offering both the Ball
Bearing Suspension and the EZ-Lock Spindle Coupling together on select Brookfield viscometers
and rheometers.
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