The Maxima ML-3500C UV lamp slashes the time it takes to cure adhesives, coatings, inks, epoxies, resins, printed circuit boards, plastics and other materials.
DEK has successfully applied mass imaging techniques to improve the uniformity of Thermal Interface Material deposited between a silicon die and its package lid during semiconductor packaging processes.
Henkel Loctite Corp. introduces Hysol QMI 550SI, a low-CTE, silica-filled, dielectric die attach adhesive designed to bond non-active package surfaces, such as bottom-die-to-substrates and die-to-dummy-spacer-die in same-size stacked die packages.
The drive head stroke length on Amacoil/Uhing Model RG linear drive assemblies may now be adjusted using optional remote control knobs located outside of the pillow block end supports, at the end of the stop rods.
Scapa North America offers a heat-reactive, thermosetting adhesive film called ThermoFilm H153U for bonding, laminating, mounting and gasketing applications.
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