The 96-page guide provides detailed technical information on the seven leading adhesive technologies that can bond the 30 most common plastic substrates.
The patent-pending Avery Dennison Shrink PS is engineered to survive the vacuum-shrink process without wrinkling, providing both shelf appeal and production-related benefits.
The ACCU-CAL™ 150 is reportedly a simple-to-operate radiometer that offers repeatable measurement of UV light, which simplifies both the validation and monitoring of a UV light-curing process.
This company’s new pneumatic servo dispensing (PSD) system is a positive rod displacement metering system that reportedly combines the cost efficiency of a pneumatic drive motor with the controlling accuracy of a servo drive motor.
The planetary dual disperser (PDDM) is reportedly ideal for the powerful mixing of high-viscosity applications requiring ultra-fine dispersion quality.
THERMLfilm® HT™ is a new advanced line of high-temperature polyimide films reportedly able to withstand the fluctuating temperatures, abrasion and chemicals inherent in the printed circuit board (PCB) manufacturing process.
To simplify silicone ingot bonding and protect against wafer breakage, this company has introduced Loctite® 3382(TM), a water-debondable epoxy adhesive that can reportedly provide excellent bond strength to both silicon and the glass and metal mounting substrates used during the ingot sawing process.
RSS