Toyochem Co. Ltd., the polymer materials division of Japan’s artience Group, is expanding the global availability of the Labelmelt™ series of its alkali-soluble hot-melt adhesives for roll-fed film labels.
A new polyolefin polymer technology enables advanced hot-melt formulations designed to deliver significant performance improvements across multiple dimensions.
Tecbond 114 from Power Adhesives has been developed for use on uncoated cardboard, making it ideal for carton closing, tray assembly and for use with packaging inserts.
The adhesives and sealants industry is driven by need to provide customers with products that improve manufacturing processes and offer stronger and more sustainable bonding.