Tecbond 114 from Power Adhesives has been developed for use on uncoated cardboard, making it ideal for carton closing, tray assembly and for use with packaging inserts.
The adhesives and sealants industry is driven by need to provide customers with products that improve manufacturing processes and offer stronger and more sustainable bonding.
A renewable raw material can be effectively incorporated into a hot-melt formulation with the objective of not only increasing the renewable content of the adhesive but also maintaining high performance standards.
Aware of the need to develop adhesives that are increasingly efficient and environmentally respectful, AIMPLAS has been actively involved in projects aimed at improving adhesive technologies.
By delivering high-strength, consistent bonds across diverse substrates, hot-melt systems are helping contractors and manufacturers meet tight deadlines, reduce disruption, and achieve clean, professional finishes.
Henkel Adhesive Technologies and Dow have expanded their strategic partnership to accelerate decarbonization in adhesives manufacturing across technologies.