Articles Tagged with ''adhesives in assembly''

Ultraviolet (UV) light-emitting diode (LED) curing technology offers significant advantages compared to traditional mercury UV curing. As a result, adhesive bonding, sealing, and coating processes in factory assembly lines are rapidly upgrading to UV LED curing technology.

We’re focusing on adhesives in assembly applications in this issue of ASI, and it’s always exciting to see the industry’s development of new technologies in this sector, as well as the increasing willingness of OEMs and others to accept them.

Vehicle manufacturers are improving fuel economy while reducing emissions by lightening the overall weight through material replacement. Using thermoplastics and adhesives instead of traditional screws and metals create less weight.

Have you ever run your hot-melt tank above the adhesive manufacturer’s recommended operating temperature? Did someone on the line ever forget to turn the equipment off at the end of the day? What about drips on the tank lid, or that one spot on the nozzle that always seems to collect buildup?

As part of a collaborative project focusing on coatings and joining systems for lightweight materials, the U.S. Army Combat Capabilities Development Command (DEVCOM) Army Research Laboratory (ARL) tasked PPG to develop a high-strength, highly ductile structural adhesive to meet the requirements of the U.S. Department of Defense’s (DoD) test method standard MIL-PRF-32662, Tier I-III specification. MIL-PRF-32662 incorporates a decade of rigorous research efforts to statistically correlate the complex ballistic response of adhesively bonded armor assemblies to universally translatable and commercially relevant quasi-static mechanical properties.

Recent innovations in the electronics industry, such as hybrid vehicles, mobile electronic devices, medical applications, digital cameras, computers, defense telecommunications, and augmented reality headsets, touch nearly every part of our lives.

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