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Home » adhesives in assembly

Articles Tagged with ''adhesives in assembly''

Ask Dr. Dave

Ask Dr. Dave’s Greatest Hits

Dave Dunn has retired as a columnist following 20 years of monthly contributions.
Dave Dunn, Ph.D.
Dave Dunn Ph.D.
February 21, 2022

After more than 20 years of sharing his expertise and wisdom in the monthly Ask Dr. Dave column, Dave Dunn has retired as a columnist. Here we share some of his most popular columns over the years.


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chassis

Electric Vehicle Market Advances Generate Adhesive Technology Innovations

As the electric vehicle market evolves and develops, adhesive manufacturers create new technologies to meet these needs.
Dave Czaplewski Manny Dias Giorgio Zaffaroni Laurie Gibbons
February 11, 2022
The use of adhesives in electric vehicles (EVs) is even more widespread than in conventional automobiles. In both types of vehicles, adhesives offer many advantages, including ease of use compared to welding, environmental resistance, sealing, distributing stress, and joining dissimilar materials.
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Photo of application of the master bond two part epoxy system

MASTER BOND: Thermally Conductive, Electrically Nonconductive, Low-Outgassing Epoxy

February 10, 2022

Master Bond EP40TC is a two-part epoxy system designed for bonding, sealing, and encapsulating applications where thermal conductivity and electrical insulation are required.


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Photo of containers of Huntsman's Araldite 2080 structural adhesive

HUNTSMAN: Non-Flammable Structural Adhesive

This adhesive reportedly helps increase end-customer and employee satisfaction, especially in confined working environments, while delivering exceptional bond performance.
January 25, 2022

Huntsman has launched its ARALDITE® 2080 adhesive, a low-odor, non-flammable (according to CLP, flashpoint > 60°C), and primer-free structural acrylate adhesive.


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tesa and usa bobsled skeleton team
Case Study

Tale of the Tape: Adhesive Tape and the USA Bobsled/Skeleton Team

The USA Bobsled/Skeleton team and tesa are teaming up to win gold at the Winter Olympics.
January 20, 2022
When USA Bobsled/Skeleton athletes hurtle down the track at speeds topping 80 miles per hour at the 2022 Winter Olympics, they’ll be relying on the science of aerodynamics—and the power of adhesion. Adhesive tape is an essential part of a bobsled and skeleton athlete’s sled and gear.
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Photo of tubes of Bostik Born2Bond electronics

BOSTIK: Engineering Adhesives for Electronics Manufacturing

The new versatile and single-component hot-melt polyurethane reactive range has been designed specifically for the manufacture of miniaturized handheld and wearable electronic devices.
January 13, 2022

Bostik, an Arkema company, has extended its Born2Bond™ engineering adhesive range designed to support the electronics manufacturing sector.


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Electronics

IPC Reports Rising Material and Labor Costs Continue to Impact Electronics Manufacturing Supply Chain

Nine in 10 electronics manufacturers reported rising materials costs, and more than three-fourths reporting rising labor costs.
January 5, 2022

IPC’s January 2022 global electronics manufacturing supply chain sentiment report found that materials and labor costs continue to be the largest issue facing the electronics supply chain.


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Ask Dr. Dave

Bonding Polystyrene to Glass

Can you recommend an adhesive for bonding a polystyrene part to glass for a consumer product? The adhesive needs some good strength, and it must be clear, cure quickly, and be easily used by relatively non-skilled operators. The final product will be used indoors and might suffer occasional impacts.
Dave Dunn, Ph.D.
Dave Dunn Ph.D.
December 17, 2021
Many adhesives will probably do the job, such as tough acrylics and epoxies. The simplest to source and start with might be a clear 5-min epoxy, dispensed from a twin-syringe and fitted with a static mixer.
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Electronics_Generic

Study Finds Semiconductor Supply Chain Will Remain Vulnerable Without Robust Federal Investment in Advanced Packaging

Increasing silicon production without bolstering domestic advanced packaging capabilities is likely to lengthen the semiconductor supply chain because chips will still have to be sent abroad for packaging and assembly into finished products.
December 9, 2021

A new study from IPC about the current state of advanced packaging in the semiconductor value chain finds that urgent action is required to strengthen the domestic packaging ecosystem to meet increased production of semiconductor chips.


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Photo of leaders from DuPont and the Zhangjiagang government at groundbreaking ceremony.

DuPont Breaks Ground on New Facility in East China

The facility will produce a range of materials to advance applications for electrification and lightweighting in support of growing demand for DuPont’s automotive adhesives.
November 22, 2021

DuPont has broken ground on a previously announced $30 million facility in Zhangjiagang, China.


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June 15, 2026

Adhesive and Sealant Council Executive Leadership Conference

This annual event provides current and future leaders in the adhesives and sealants industry with the opportunity to expand their knowledge and network with peers.

September 14, 2026

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Structural Adhesives: Properties, Characterization and Applications

Structural Adhesives: Properties, Characterization and Applications

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