Adhesives in electrical/electronic - Articles - Page 51

Ellsworth Adhesives Participates in Strategies in Light Conference

February 17, 2015

Ellsworth Adhesives recently announced it will exhibit at Strategies in Light, taking place February 24-26 in Las Vegas.

Auto, Electronics Markets Spur High-Temp Adhesives Market Growth

February 12, 2015

The high-temperature adhesives market is projected to grow at a compound annual growth rate (CAGR) of 4.6%.

H.B. Fuller Completes Two Acquisitions to Expand Presence in Africa and China

February 9, 2015

H.B. Fuller Co. recently announced that it has finalized the previously announced purchase of Continental Products Ltd. and TONSAN Adhesive Inc.

Adhesives at Work: Stuck on Heat Sinks

The performance of a heat sink can be improved by using thermal adhesives.

Maureen McHale

February 2, 2015

If you’re like most modern-day professionals, each morning you boot up your computer and work late into the day. During that time, you probably don’t even think twice about the heat sink inside your computer, do you?

Ask Dr. Dave: What advantages do I have if I choose an adhesive that has MIL-SPEC approval?

If you buy an adhesive or sealant that has MIL-SPEC approval, it means the product has passed certain performance specifications.

Dave Dunn Ph.D.

February 2, 2015

Dave Dunn's February 2015 column.

Solutions in Silicone

Silicone's coil-like structure has enabled the creation of a wide range of previously unimaginable products.

February 2, 2015

The second most common element on earth, silicon represents 28% of the earth’s crust and is found in sand, silicates, and many minerals such as quartz.

Adhesives at Work: Using Conductive Adhesives for Thermal Management in Micro- and Power Electronics

Thermally conductive adhesives are a proven yet underutilized bonding solution in electronics engineering.

Arno Maurer

February 2, 2015

The increase in demand for mobile electronic devices has brought about new design challenges with an ever-greater emphasis on mechanical strength and thermal management capability.