Articles Tagged with ''innovation''

Gelest Barry Arkles

Gelest’s Arkles Receives American Chemical Society 2020 Kipping Award

The Kipping award was established in 1960 by Dow Corning Corp. to commemorate the achievements of Prof. Frederic Stanley Kipping.
Gelest, Inc. recently announced that Barry Arkles, Ph.D., founder, president, and chief technology officer, is the recipient of the American Chemical Society 2020 Frederic Stanley Kipping Award in Silicon Chemistry.
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Henkel EV battery pack materials

Henkel to Debut Electric Vehicle Battery Material Solutions at the Electric & Hybrid Vehicle Technology Expo

Henkel materials specialists have reportedly developed novel formulations that allow for large-scale production at high speed, reduce the risk of thermal event-related safety concerns, and enable various battery architectures.

At the 2019 Electric & Hybrid Vehicle Technology Expo, which will be held September 10-12 in Novi, Mich., Henkel reports that it will display its latest material technologies for cost-effective high-volume assembly, protection, and thermal control of next-generation electric vehicle (EV) battery systems.


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Designing Rebondable Structural Adhesives

Aromatic thermosetting polyesters have been shown to be fully compatible with the reversible bonding adhesion concept.
Jacob Meyer Zeba Parkar

Reversible adhesion inspired by the gecko has attracted attention in applications such as biomedical masks, climbing robots, transfer printing, and pressure-sensitive adhesives.


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Susan Sutton updated Editor's Memo
Editor's Memo

Welcome to Fall!

I hope you were able to enjoy some well-earned time off over the summer and are ready to get back to work!
Susan Sutton
Susan Sutton

If you’re anything like me, the onset of fall leaves you feeling a bit bittersweet.


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Zymet SMTA International conference

Zymet and Portland State to Present on Reworkable Adhesives for Wafer-Level Packages at SMTA International Conference

The investigation reportedly shows that reworkable adhesives can enhance the board-level reliability of large WLPs, even for harsh environment applications.
At the SMTA International 2019 technical conference, which will be held September 22-26 in Rosemont, Ill., Portland State University and Zymet will present their investigations on enhancing the board-level reliability of large wafer-level packages (WLPs) for harsh environment applications.
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Covestro wind energy research

Covestro Partners with Industry and University in Wind Energy Research Project

Leading global manufacturers of wind energy systems and coatings are reportedly members of the consortium involved with the DURALEDGE project.
Covestro recently announced that it is serving as a key raw materials partner in a consortium managed by the Technical University of Denmark that is currently carrying out a research project called DURALEDGE (from durable leading edges) to investigate erosion mechanisms and develop new coatings to permanently protect rotor blades.
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Dow Announces Plans to Explore Big Issues at K 2019 Event

During the event, Dow reports that it will showcase a wide variety of products while sharing its approach to global issues.
Dow recently announced that it is looking to encourage debate across the industry at K 2019, which will be held October 16-23, 2019 in Düsseldorf, Germany.
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2019 ASI Top 20 Adhesives and Sealants Manufacturers List

To develop the 2019 ASI Top 20 ranking of leading global adhesives and sealants manufacturers, we worked diligently to target company details focused specifically on adhesives and sealants.
Susan Sutton
Susan Sutton

Welcome to the ASI Top 20, our annual feature detailing the leading worldwide manufacturers of adhesives and sealants. To develop the ranking, we worked diligently to target sales figures (and other details) focused specifically on adhesives and sealants.


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