Converting/Packaging - Articles - Page 15 | Adhesives & Sealants Industry

Dow Nets Four 2019 R&D 100 Awards

The R&D 100 awards honor research and development pioneers and their contributions to science and technology.

November 18, 2019

Four technologies from Dow were recently recognized with 2019 R&D 100 awards from R&D World magazine.

H.B. Fuller’s Price Receives PMMI 2019 On the Rise Award

This award, produced by the PMMI Emerging Leaders Network, reportedly recognizes young professionals who show promise in shaping the packaging industry.

November 7, 2019

H.B. Fuller Co. recently announced that Garrett Price, market manager for its Packaging and Labeling business, has been selected for a Packaging Machinery Manufacturer Institute (PMMI) 2019 On the Rise Award.

3M: High-Tack Box Sealing Tape

With its consistent, pressure-sensitive, high-performance, hot-melt synthetic rubber adhesive system, the upgraded tape reportedly adheres rapidly to a variety of surfaces.

November 5, 2019

3M recently announced the availability of Scotch 375+ high-tack box sealing tape, an industrial packaging tape used for box sealing, splicing, recouperage, and other packaging applications.

DOW: High-Solids Adhesive for High-Speed Metal Lamination

Designed to work on a broad range of medium-performance applications and packaging structures, Dow’s new adhesive reportedly offers up to 55% high-solids content in application.

October 31, 2019

Dow recently announced that it has expanded its portfolio of solvent-based adhesives with the new ADCOTE L76-500 high-solids adhesive, reportedly opening new opportunities beyond traditional metal-to-film lamination.

Recycling Partnership Launches U.S. Circular Economy Roadmap

To build a bridge between the current system and an optimized circular system, The Recycling Partnership is calling for a set of concrete actions based on three distinct issues currently undermining the U.S. recycling industry.

October 24, 2019

The Recycling Partnership recently announced what is reportedly the first-ever roadmap aimed at addressing systemic issues in the U.S. recycling system and catalyzing the transition toward a circular economy for packaging.

AVERY DENNISON: Label Adhesive Technology for Rough Surfaces

Surfas adhesive technology was reportedly developed for ultimate strength and bond when labeling rough substrates.

October 22, 2019

Avery Dennison introduced its new Surfas technology at the recent Labelexpo Europe.

Berry Global and Digimarc to Promote Innovation in Recycling with HolyGrail 2.0 Initiative

Digimarc Barcode is a technique to “tag” plastic substrates or print materials (e.g., shrink sleeve, IML label, or paper label) with an identity that could include attributes such as plastic type, product manufacturer, product SKU, and food or non-food usage.

October 21, 2019

Berry Global Group, Inc. recently announced its participation in the new recycling initiative, HolyGrail 2.0.

Winners of 16th Label Industry Global Awards Announced at Labelexpo Europe

The Label Industry Global Awards reportedly recognize the most innovative, influential, and successful work from the label and package printing industry across the globe in the last 12 months.

October 7, 2019

Avery Dennison, Esko, and GMG were among the category winners honored at this year’s Label Industry Global Awards, which took place on September 24 at Brussels Expo, Belgium, the first night of Labelexpo Europe 2019.

Dow Unveils Pressure-Sensitive Solutions for Paper and Film Label Applications at Labelexpo Europe

Dow reports that the new offering expands its portfolio for pressure-sensitive label applications with solutions that address key market trends.

September 30, 2019

At the recent Labelexpo Europe 2019, Dow introduced a range of new SYL-OFF silicone release coatings and INVISU acrylic adhesives designed for paper and film label applications.