Avery Dennison has combined its proprietary CleanFlake™ adhesive technology, materials science capabilities, and expertise in RFID to develop a new proprietary RFID label that cleanly separates from the PET in the mechanical recycling stream.
Born2Bond™ Ultra K85 from Bostik is an instant engineering adhesive processed from 60% bio-based raw materials that offers exceptional heat and humidity resistance.
LG Chem has co-developed a high-performance silver paste with Japan’s Noritake that is designed specifically for bonding silicon carbide (SiC) chips to substrates in automotive power semiconductors.
Creative Materials Inc. recently launched a series of multi-purpose conductive epoxies that combine flexibility with fine-line precision and extreme durability.