DYMAX has introduced a new line of light and activator curing adhesives for choke and transformer assembly that cure and fixture in seconds, making automation of gapped and ungapped cores easier and faster.
Tra-Bond CA20 is a thixotropic epoxy adhesive system specially formulated for shortened turns, damaged end wire extensions, or other coil repair applications where a high-fill, non-sag adhesive is required.
Clariant's Pigments and Additives Division presents Licomont AR 504, a polypropylene wax grafted with maleic anhydride intended for use in natural fibre reinforced plastics.
Henkel Loctite Corp. has introduced Loctite Multicore MFR301, a no-clean sustained activity liquid flux designed for wave soldering PCBs, especially those with copper substrates.
Speedline Technologies Inc. has introduced MPM's next generation pump technology, a design that reduces materials costs, facilitates quick changeovers and expands the range of usable materials.
Fusion UV Systems launched its Light Hammer 10 (LH10), a high power 10-inch UV curing system, designed to provide a higher degree of conversion, higher speeds and better depth of cure than typically achieved with other UV sources.
RSS