Adhesive & Sealant Products

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Dow recently announced the availability of its new solvent-free SYL-OFF™ SL 184 coating, an energy-efficient alternative that minimizes misting at high product label production line speeds.

Henkel has introduced three new low-pressure molding (LPM) materials designed to seal and protect medical devices from moisture, temperature extremes, chemicals, vibration, impact, and other environmental concerns.

ViscoTec recently introduced cartridge applicators featuring Festo pneumatic control modules for the exact and clean feeding of adhesives, pastes, and silicones of different viscosities. 

A self-adhesive, reusable, and compressible sleeve, tesa^® Twinlock can reportedly help packaging printers achieve greater operational efficiency and improve return on investment while reducing the solid waste associated with packaging printing.

Huntsman has launched its ARALDITE^® 2080 adhesive, a low-odor, non-flammable (according to CLP, flashpoint > 60°C), and primer-free structural acrylate adhesive.

Multi-shaft mixers with solids/liquid injection manifold (SLIM) technology from Charles Ross & Son Co. reportedly enable fast and efficient large-scale powder dispersion into low-viscosity liquids.

FEICA, the Association of the European Adhesive and Sealant Industry, recently released a market study focusing on “The European Adhesives and Sealants Market.”

Bostik, an Arkema company, has extended its Born2Bond™ engineering adhesive range designed to support the electronics manufacturing sector.

Creative Materials recently introduced 122-47—a polyimide, single-component, silver filled, electrically conductive semiconductor die-attach adhesive.

Safe to use and sustainable, TEGO Foamex 8820 and 8850 defoamer concentrates reportedly provide a bio-renewable content of more than 55%.