Hysol® QMI538NB non-conductive die attach adhesive is a PTFE-filled paste with low viscosity and reduced resin bleed (even on open channels) designed specifically for use with SCSPs or other stacked packages.
A new, highly flexible modular curing system designed for a range of applications, including DVD production, medical devices, semiconductor wafer, disc drive, and optics fabrication, has been introduced by Xenon Corp. of Wilmington, MA.
Designed for multiple mixing requirements, such as high-speed dispersion, emulsification, particle-size reduction and homogenization, the Ross VersaMix Triple Shaft Mixer is now available with a Solid/Liquid Injection Manifold (S.L.I.M.™) system.
CPFilms, Inc., a leading manufacturer of precision-coated films for electronics, medical, high technology, industrial, commercial and solar-control applications, now offers polyester-based release liners especially well suited for medical applications.
RSS