Loctite® Eccobond® UF 1173 has been developed. The protective underfill material, which has reportedly been formulated with health and safety in mind, does not contain any reportable REACH SVHCs, is not CMR classified and delivers outstanding performance under high operating temperature environments.
“The miniaturization trend is now firmly part of the automotive and aerospace sectors, particularly for advanced driver assistance system (ADAS) technologies such as cameras, radars and lidars; as well as aerospace, satellite and UAV applications,” said Vinod Partha, market segment head for ADAS and safety. “The use of fine-pitch array devices such as BGAs and CSPs within these systems has increased dramatically, making interconnect protection a critical component for long-term reliability and performance. LOCTITE ECCOBOND UF 1173 provides this essential protection in a formulation that can withstand the high operating temperatures induced by smaller, higher functioning devices within challenging operating conditions.”
For more information, visit www.henkel-adhesives.com/electronics.
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