The new versatile and single-component hot-melt polyurethane reactive range has been designed specifically for the manufacture of miniaturized handheld and wearable electronic devices.
January 13, 2022
Bostik, an Arkema company, has extended its Born2Bond™ engineering adhesive range designed to support the electronics manufacturing sector.
IPC APEX EXPO returns as an in-person event January 22-27 in San Diego, Calif.
January 12, 2022
IPC APEX EXPO 2022 will welcome the electronics manufacturing community to the San Diego Convention Center in San Diego, Calif., on January 22-27. The largest North American event for the electronics manufacturing industry is expected to draw approximately 9,000 attendees from 45 countries.
New dispensing technologies offer the electronics industry maximum productivity, flexibility, and functionality.
January 7, 2022
The electronics market is booming, and its trends toward component miniaturization, increasingly short cycles, and highest dispensing quality require constant innovation. Dispensing systems are key technologies in an environment of increasing automation and demand for high product output.
Nine in 10 electronics manufacturers reported rising materials costs, and more than three-fourths reporting rising labor costs.
January 5, 2022
IPC’s January 2022 global electronics manufacturing supply chain sentiment report found that materials and labor costs continue to be the largest issue facing the electronics supply chain.
Increasing silicon production without bolstering domestic advanced packaging capabilities is likely to lengthen the semiconductor supply chain because chips will still have to be sent abroad for packaging and assembly into finished products.
December 9, 2021
A new study from IPC about the current state of advanced packaging in the semiconductor value chain finds that urgent action is required to strengthen the domestic packaging ecosystem to meet increased production of semiconductor chips.
The Industrial Advisory Committee will consist of expert leaders representing a range of organization sizes from industry, federal laboratories, and academic institutions.
December 6, 2021
The U.S. Commerce Department has established a high-level committee to advise the U.S. government on matters related to microelectronics research, development, manufacturing, and policy and is now seeking to recruit top-level candidates to serve on the committee.
The facility will produce a range of materials to advance applications for electrification and lightweighting in support of growing demand for DuPont’s automotive adhesives.
November 22, 2021
DuPont has broken ground on a previously announced $30 million facility in Zhangjiagang, China.
Among the survey results, companies report that they continue to face difficulty in finding qualified talent.
November 15, 2021
A new global survey conducted by IPC found that the global shortage of semiconductors and other components continues to have serious consequences for electronics manufacturers.