Adhesives in electrical/electronic - Articles - Page 15

HENKEL: Low-Pressure Molding Materials for Medical Electronics

February 3, 2022

Henkel has introduced three new low-pressure molding (LPM) materials designed to seal and protect medical devices from moisture, temperature extremes, chemicals, vibration, impact, and other environmental concerns.

VISCO-TEC: High-Precision Two-Component Adhesive Dosing

February 1, 2022

ViscoTec recently introduced cartridge applicators featuring Festo pneumatic control modules for the exact and clean feeding of adhesives, pastes, and silicones of different viscosities.

DuPont Microcircuit and Components Materials Collaborates with Kuprion

A new agreement for ActiveCopper™ products will enhance DuPont Microcircuit and Components Materials’ thick film paste portfolio.

January 27, 2022

The DuPont Microcircuit and Components Materials (MCM) business has announced a strategic collaboration with Kuprion Inc. to launch the ActiveCopper™ thick film paste suite of products to the electronics industry.

Top 5 News that Sticks

Readers Drawn to Latest Henkel Investment

Last week, an announcement from Henkel regarding an investment in the medical sector garnered the most reader interest.

Susan Sutton

January 24, 2022

How does your company evaluate growth opportunities? I’d love to hear your story! Please contact me at (248) 786-1704 or suttons@bnpmedia.com.

Photo of tubes of Bostik Born2Bond electronics

BOSTIK: Engineering Adhesives for Electronics Manufacturing

The new versatile and single-component hot-melt polyurethane reactive range has been designed specifically for the manufacture of miniaturized handheld and wearable electronic devices.

January 13, 2022

Bostik, an Arkema company, has extended its Born2Bond™ engineering adhesive range designed to support the electronics manufacturing sector.

Electronics Industry to Gather at IPC APEX EXPO 2022

IPC APEX EXPO returns as an in-person event January 22-27 in San Diego, Calif.

January 12, 2022

IPC APEX EXPO 2022 will welcome the electronics manufacturing community to the San Diego Convention Center in San Diego, Calif., on January 22-27. The largest North American event for the electronics manufacturing industry is expected to draw approximately 9,000 attendees from 45 countries.

CREATIVE MATERIALS: Semiconductor Die-Attach Adhesive

The product can be applied by stamping, screen printing, dipping, and syringe dispensing.

January 11, 2022

Creative Materials recently introduced 122-47—a polyimide, single-component, silver filled, electrically conductive semiconductor die-attach adhesive.

Product Profile

High-Performance Adhesive Dispensing for Electronics Applications

New dispensing technologies offer the electronics industry maximum productivity, flexibility, and functionality.

January 7, 2022

The electronics market is booming, and its trends toward component miniaturization, increasingly short cycles, and highest dispensing quality require constant innovation. Dispensing systems are key technologies in an environment of increasing automation and demand for high product output.

IPC Reports Rising Material and Labor Costs Continue to Impact Electronics Manufacturing Supply Chain

Nine in 10 electronics manufacturers reported rising materials costs, and more than three-fourths reporting rising labor costs.

January 5, 2022

IPC’s January 2022 global electronics manufacturing supply chain sentiment report found that materials and labor costs continue to be the largest issue facing the electronics supply chain.