Articles Tagged with ''adhesives in electrical/electronic''

CREATIVE MATERIALS: Semiconductor Die-Attach Adhesive

The product can be applied by stamping, screen printing, dipping, and syringe dispensing.

January 11, 2022

Creative Materials recently introduced 122-47—a polyimide, single-component, silver filled, electrically conductive semiconductor die-attach adhesive.

Product Profile

High-Performance Adhesive Dispensing for Electronics Applications

New dispensing technologies offer the electronics industry maximum productivity, flexibility, and functionality.

January 7, 2022

The electronics market is booming, and its trends toward component miniaturization, increasingly short cycles, and highest dispensing quality require constant innovation. Dispensing systems are key technologies in an environment of increasing automation and demand for high product output.

IPC Reports Rising Material and Labor Costs Continue to Impact Electronics Manufacturing Supply Chain

Nine in 10 electronics manufacturers reported rising materials costs, and more than three-fourths reporting rising labor costs.

January 5, 2022

IPC’s January 2022 global electronics manufacturing supply chain sentiment report found that materials and labor costs continue to be the largest issue facing the electronics supply chain.

2021 Year in Review

From 2021’s in-depth feature articles to industry news stories, new product releases, and podcasts, readers sought out ASI content like never before.

December 10, 2021

Join us on a walk down memory lane as we revisit our most popular content of 2021.

Study Finds Semiconductor Supply Chain Will Remain Vulnerable Without Robust Federal Investment in Advanced Packaging

Increasing silicon production without bolstering domestic advanced packaging capabilities is likely to lengthen the semiconductor supply chain because chips will still have to be sent abroad for packaging and assembly into finished products.

December 9, 2021

A new study from IPC about the current state of advanced packaging in the semiconductor value chain finds that urgent action is required to strengthen the domestic packaging ecosystem to meet increased production of semiconductor chips.

Department of Commerce Establishes Industrial Advisory Committee for Microelectronics

The Industrial Advisory Committee will consist of expert leaders representing a range of organization sizes from industry, federal laboratories, and academic institutions.

December 6, 2021

The U.S. Commerce Department has established a high-level committee to advise the U.S. government on matters related to microelectronics research, development, manufacturing, and policy and is now seeking to recruit top-level candidates to serve on the committee.

Photo of leaders from DuPont and the Zhangjiagang government at groundbreaking ceremony.

DuPont Breaks Ground on New Facility in East China

The facility will produce a range of materials to advance applications for electrification and lightweighting in support of growing demand for DuPont’s automotive adhesives.

November 22, 2021

DuPont has broken ground on a previously announced $30 million facility in Zhangjiagang, China.

Electronics Manufacturing Outlook Continues to Darken

Among the survey results, companies report that they continue to face difficulty in finding qualified talent.

November 15, 2021

A new global survey conducted by IPC found that the global shortage of semiconductors and other components continues to have serious consequences for electronics manufacturers.

Latex Binders, Lithium-Ion Batteries, and Electric Vehicles

Although binder adhesives are a small component of the lithium-ion batteries that power electric vehicles, they play a critical role in ensuring performance and efficiency while providing improved battery kinetics.

Christian Page

November 10, 2021

Materials companies are searching for solutions to refine the Li-ion battery, increase its capacity, and enhance its charging capabilities without increasing its weight. New innovation is required to take Li-ion batteries to the next level. Part of the solution lies with binder adhesives.

Photo showing curing of Master Bond LED405FL3

MASTER BOND: LED-Curable Adhesive

LED405FL3 is a low-viscosity system that can be used for small potting and encapsulation applications, assuming that there are no shadows or concealed areas.

November 9, 2021

Master Bond LED405FL3 is reportedly a flexible, one-component, LED-curing adhesive system with excellent optical clarity and a refractive index of 1.51.

This annual Midwest coatings conference combines all of the high-quality technical presentations, exhibits and networking opportunities from the Coatings Trends and Technologies and Powder Coating Summit conferences into one new event. The event caters to both liquid and powder coatings formulators and manufacturers.

As the industry’s premier international event, WAC 2026 offers a unique opportunity for professionals from every continent to connect, collaborate, and shape the future of the sector.