Adhesives in electrical/electronic - Articles - Page 13

From the Editor

A Wintery Mix

Our February issue brings articles on a wide range of topics, including green formulations and applications, curing materials, transportation end uses, and much more.

Susan Sutton

February 25, 2022

To start us off, Jowat’s Gerhard Haas asks: How can we make adhesives and bonding processes more sustainable? Luckily, he also provides some insightful answers clustered under a central recommendation to seek a holistic approach to sustainability. Learn more in “Green Bonding.”

Electric Vehicle Market Advances Generate Adhesive Technology Innovations

As the electric vehicle market evolves and develops, adhesive manufacturers create new technologies to meet these needs.

Dave Czaplewski Manny Dias Giorgio Zaffaroni Laurie Gibbons

February 11, 2022

The use of adhesives in electric vehicles (EVs) is even more widespread than in conventional automobiles. In both types of vehicles, adhesives offer many advantages, including ease of use compared to welding, environmental resistance, sealing, distributing stress, and joining dissimilar materials.

Photo of application of the master bond two part epoxy system

MASTER BOND: Thermally Conductive, Electrically Nonconductive, Low-Outgassing Epoxy

February 10, 2022

Master Bond EP40TC is a two-part epoxy system designed for bonding, sealing, and encapsulating applications where thermal conductivity and electrical insulation are required.

Electronics Manufacturing Industry Reconnects at IPC APEX EXPO 2022

The event featured a technical conference, professional development courses, standards development committee meetings, and a show floor that included 282 exhibitors.

February 10, 2022

Organizers of IPC APEX EXPO 2022 report that the event provided the education and networking connections that helped 3,647 visitors address today’s business challenges and prepare for their factories of the future.

Top 5 News that Sticks

H.B. Fuller Retains Top Position with New Acquisitions Announcement

An announcement from H.B. Fuller regarding two acquisitions drew strong reader interest to keep the company in the top position for the second consecutive week.

Susan Sutton

February 7, 2022

Are you up to date on all of the latest industry acquisitions? Subscribe to ASI eNews, and we’ll deliver the news directly to you!

HENKEL: Low-Pressure Molding Materials for Medical Electronics

February 3, 2022

Henkel has introduced three new low-pressure molding (LPM) materials designed to seal and protect medical devices from moisture, temperature extremes, chemicals, vibration, impact, and other environmental concerns.

VISCO-TEC: High-Precision Two-Component Adhesive Dosing

February 1, 2022

ViscoTec recently introduced cartridge applicators featuring Festo pneumatic control modules for the exact and clean feeding of adhesives, pastes, and silicones of different viscosities.

DuPont Microcircuit and Components Materials Collaborates with Kuprion

A new agreement for ActiveCopper™ products will enhance DuPont Microcircuit and Components Materials’ thick film paste portfolio.

January 27, 2022

The DuPont Microcircuit and Components Materials (MCM) business has announced a strategic collaboration with Kuprion Inc. to launch the ActiveCopper™ thick film paste suite of products to the electronics industry.

Top 5 News that Sticks

Readers Drawn to Latest Henkel Investment

Last week, an announcement from Henkel regarding an investment in the medical sector garnered the most reader interest.

Susan Sutton

January 24, 2022

How does your company evaluate growth opportunities? I’d love to hear your story! Please contact me at (248) 786-1704 or suttons@bnpmedia.com.

Photo of tubes of Bostik Born2Bond electronics

BOSTIK: Engineering Adhesives for Electronics Manufacturing

The new versatile and single-component hot-melt polyurethane reactive range has been designed specifically for the manufacture of miniaturized handheld and wearable electronic devices.

January 13, 2022

Bostik, an Arkema company, has extended its Born2Bond™ engineering adhesive range designed to support the electronics manufacturing sector.