Articles Tagged with ''adhesives in electrical/electronic''

Zymet SMTA International conference

Zymet and Portland State to Present on Reworkable Adhesives for Wafer-Level Packages at SMTA International Conference

The investigation reportedly shows that reworkable adhesives can enhance the board-level reliability of large WLPs, even for harsh environment applications.
August 23, 2019
At the SMTA International 2019 technical conference, which will be held September 22-26 in Rosemont, Ill., Portland State University and Zymet will present their investigations on enhancing the board-level reliability of large wafer-level packages (WLPs) for harsh environment applications.
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Electronics_Generic

Nordson MARCH Presents Paper on Plasma Applications for Wafer-Level Packaging at ICEPT

Jiangang (Jack) Zhao, Ph.D., applications director and chief scientist, presented original data and discussed typical plasma applications that enable or improve process steps for wafer-level packaging (WLP).
August 16, 2019
Nordson MARCH, a Nordson company, recently presented a paper entitled “Plasma Applications for Wafer Level Packaging, Part 1,” at the 20th annual International Conference on Electronic Packaging Technology (ICEPT) in Hong Kong.
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Master Bond Supreme electronics adhesives

MASTER BOND INC.: Non-Premixed and Frozen, One-Part Epoxy for Chip Coating

Supreme 3CCM-85 reportedly cures within 2-3 hrs at 175-185°F (80-85°C), which is advantageous for use on heat-sensitive components and substrates.
August 7, 2019
Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is reportedly a new single-component epoxy initially designed for glob top and chip coating applications.
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Techsil electronic adhesives

TECHSIL: Electronics Adhesives

These adhesives were reportedly specially formulated for applications in the electronics and consumer electronics industry, where heat-sensitive parts need to be assembled.
July 25, 2019
Techsil recently announced that it has launched a range of new adhesive products with low ion content that cure with UV, visible light, or moisture.
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Panacol optically clear adhesive

PANACOL: Optically Clear Adhesive

The one-component UV-curable acrylic adhesive with ultra-low viscosity is used for bonding displays and laminating optics.
July 5, 2019

Panacol has developed Vitralit® 50004, a new optically clear adhesive.


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SEMICON West Helps Attendees Move "Beyond Smart"

SEMICON West will reportedly take aim at global electronics manufacturing industry disruptors with programs and pavilions focused on critical areas of industry growth.
June 28, 2019

The 49th SEMICON West will be held July 9-11, 2019, at the Moscone Center in San Francisco.


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