According to the company, this epoxy foam offers good adhesion to a variety of substrates, is particularly suitable for void-filling applications, and has good compressive strength for the backfilling of parts.
October 17, 2019
Robnor ResinLab recently announced the launch of a new development material, PX19-GE3259-03.
Most of the installation occurred as a component of the new construction of large logistic warehousing along the Eastern Seaboard.
October 14, 2019
Industrial Caulk and Seal (ICS) recently announced that, as of last month, it had installed over 1 million linear feet of semi-rigid joint filler through the previous 12 months.
A structural adhesive is a “load-bearing” adhesive that is used to bond a joint and is capable of holding two or more substrates together under stress.
The desire to reduce vehicle emissions, especially in densely populated areas, is driving the replacement of combustion engine-powered cars with electrical vehicles.
The epoxy-based adhesive reportedly hardens with UV light within a few seconds and can be used for semiconductor production due to its low ion content.
September 26, 2019
At this year’s Bondexpo, which will be held October 7-10 in Stuttgart, Germany, Panacol will present Vitralit UC 1535, a new transparent adhesive specifically designed for use in electronics.
In response to environmental concerns, many industries are moving from protective coating products containing solvents to 100% solid epoxies and urethanes.
Supreme 3CCM-85 reportedly cures within 2-3 hrs at 175-185°F (80-85°C), which is advantageous for use on heat-sensitive components and substrates.
August 7, 2019
Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is reportedly a new single-component epoxy initially designed for glob top and chip coating applications.